Track record

Two prior deep-tech exits. One operating playbook.

NuvoNexus operates on a pattern proven twice before — building deep-tech companies from invention through customer development to acquisition by major defense and materials primes. The same operating discipline now backs the current portfolio.

2026 —

NuvoNexus, LLC — current portfolio

Active operating companies in defense materials, defense electronics, and industrial asset recovery. Four funded U.S. defense programs across MacroVation. Helicon Defense in formation. 125+ patents across the leadership team.

In motion
2019

Nuvotronics — acquired by Cubic Corporation

Founded by David Sherrer in 2008. Spun out of Rohm and Haas Electronic Materials. Built PolyStrata 3D-microfabricated millimeter-wave components for U.S. defense and aerospace customers — a category- defining capability for high-frequency RF that ran from invention through DARPA Phase I–III execution to commercial production. Acquired by Cubic Corporation in 2019.

Defense electronics · 11-year build · Acquired by Cubic
2008–2019

PolyStrata commercialization at Nuvotronics

DARPA Phase I, II, and III contracts. Government and prime-contractor customer development. Manufacturing scale-up. Technology transition into fielded U.S. defense and aerospace systems.

DARPA Phase I–III · Multi-year customer build
2002

Haleos — acquired by Rohm and Haas Electronic Materials

Founded as ACT MicroDevices in 1996. Re-incorporated as Haleos. Pioneering work in micro-electronic materials and 3D microfabrication. Acquired by Rohm and Haas Electronic Materials in 2002, where the IP became the seed of the PolyStrata platform.

Materials · 6-year build · Acquired by Rohm and Haas
1996

ACT MicroDevices — first deep-tech company

Founded by David Sherrer. Early-stage micro-electronic materials and device work that anchored the technology family carried forward through Haleos and Nuvotronics.

Founded 1996 · First deep-tech build
2x
Deep-tech exits
125+
Issued patents
30 yrs
Deep-tech operator
DARPA I–III
Program execution